Author: | E. Fisher |
Reviewer(s): | |
Editor(s): | S. Boehm, S. Frank |
Management Approval (Name, Title, Date): | B. Mills (Lab Officer) |
Audience: | Technicians |
Origination date: | 5/1/2013 |
Current version: | 7/30/2018 |
Revised: | |
Domain: | Thin Section Lab |
System: | Logitech WG2 |
Keywords: | Polishing Samples |
Figure 1
3. Checking system (Fig. 2) screen will appear. Press ok to continue.
Figure 2
4. Process Screen and Machine Setup (Fig. 3) will appear.
Figure 3
5. Select Process Screen and press ok.
6. On the Confirm Action (Fig. 4) screen move the joystick down and press Ok.
Figure 4
7. Press ok on the Please Set Position (Fig. 5) screen.
Figure 5
8. The Operations (Fig. 6) screen will appear.
Figure 6
9. Place the abrasive drum (Fig. 7) on the top of the WG2.
10. Check polishing pad (Fig. 7) for wear. The polishing pad is a Kempad No. 150022.
Figure 7
a. Lift the polishing plate and pull it out from under the WG2.
b. Place the polishing plate on the padded floor and peel off the old polishing pad.
c. Clean the polishing plate with a kimwipe and isopropyl alcohol.
d. Begin to remove the backing of the polishing pad. Do not pull it all the way off.
e. Line up the edges of the polishing pad and polishing plate. Press the pad down by sweeping your hand back and forth across it to prevent from bubbles forming under it (Fig. 8).
Figure 8
f. Slowly, remove the backing and continue sweeping your hand.
g. Fold the backing in quarters with the smooth side on the outside. Press on it and move it around the pad. This will help secure the pad and remove any bubbles (Fig. 9).
Figure 9
h. Replace the polishing plate and lower the WG2.
Figure 10
3. Place sample face down on the polishing pad under a carousel post (Fig. 11).
4. Lower the post down by rotating it counter clockwise and gently setting it down in the middle hole of the slide holder (Fig. 11).
Figure 11
Figure 12
5. Add two weights to each post that has a sample under it.
6. Select Abrasive on the Operations (Fig. 6) screen.
Figure 13
c. Start the slurry dripping on the polishing plate by spraying ethane diol into the drip tray.
7. Set Time (Fig. 6) to 8 minutes for the first round of polishing.
8. Select Sweep (Fig. 6) and press ok; make the Inner 40%, Outer 100%, and Speed 100%.
9. Select Plate and press ok. Make sure it is set to 5 rpms.
10. Select Start and press ok.
11. Increase the plate speed to 58 rpms.
12. Watch the samples. The carousel and the sample holder should be rotating. Also, make sure the samples are not "sweeping" too far or they will go off the polishing pad.
13. When the time has elapsed press Stop.
14. Reset the plate speed to 5 rpms.
15. Remove the sample holders by lifting the post and rotating them. The weights can be left on.
16. Remove the sample from the holders by pulling up on one corner with your thumb. It is a good idea to wear gloves when removing the slides.
17. Clean the samples and dry them.
18. Measure the samples with the micrometer (refer to the Lapping Samples user guide) and make note of their thickness on the sample tray.
19. After the first time on the polishers scrape off the excess resin with a flat razor. If the resin is left on it will prevent the sample from polishing down to the target thickness.
20. Before leaving at the end of shift make sure the scoop in the abrasive drum is out of the slurry.
Original version created by Emily Fisher
5/1/2013