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Thin Section Lab on Fo'c's'le Deck


Overview

The Thin Section lab contains equipment for sample preparation of lithified and nonlithified materials for microscopy and microanalytical analysis (e.g. SEM-EDS). Thin section lab technicians are equipped to prepare core material in a wide variety of preparations, including but not limited to thin sections, polished thin sections, and grain mounts. Protocols for thin section creation vary based on material, and can be performed by hand (Buehler MetaServ 250) or through a largely automated process (Logitech LP-50 lapping machine).

Instruments

  • Buehler Petrothin thin section cutting blade and cup wheel
  • Logitech LP-50

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     Logitech LP50 Setup 374.docx

Frosting Slides 378P

     Frosting Slides 374.docxHOW TO TAKE APART THE LOGITECH JIGS.docx

Flattening Thin Section Billets 378P

     Flattening Thin Section Billets 374.docx

Bonding Billets to Frosted Slides 378P

     Bonding Billets to Frosted Slides 374.docx

Cutting Billets with PetroThin 378P

     Cutting Billets with PetroThin 374.docx

LAPPING SAMPLES ON LP50 378P

     LAPPING SAMPLES ON LP50 374.docx

POLISHING SAMPLES ON PM5 378P

     POLISHING SAMPLES ON THE LOGITECH WG2 374.docx

End of Expedition Cleanup 378P

     End of Expedition Cleanup 374.docx

Quick Guide TS laser engraver 378P

     Quick Guide_TS-engraver 374.docx

HOW TO TAKE APART THE LOGITECH JIGS

     HOW TO TAKE APART THE LOGITECH JIGS.docx

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